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Revolutionizing Electronics Packaging Exploring the Latest Developments in Thermal Meta-materials and Their Future Applications
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How to Cite:
[1] Satish Patel, Rathod Himanshu, Aditya Pratap Singh, Pankaj Kumar Vaishnav, “Revolutionizing Electronics Packaging Exploring the Latest Developments in Thermal Meta-materials and Their Future Applications,” International Advanced Research Journal in Science, Engineering and Technology (IARJSET)
